From Wafer to Rack: Examining How the Fastest AI Interconnects Are Made
Lightmatter takes you inside the manufacturing process of the Passage M1000 3D photonic interposer. Follow the complete journey from wafer fabrication and advanced packaging to testing, integration, and final system assembly.
Lightmatter InterConnect 2026 Keynote Presentation
InterConnect 2026 keynote: photonic interconnects, co-packaged optics, and the future of AI. Explore how next-generation networking technologies will enable larger AI systems, faster movement, and unprecedented scaling across AI training and inference.
Passage M1000: Powering the Next 1000x in AI Performance
Explore the Passage M1000 Reference System, a groundbreaking platform built around the Passage M1000 3D Photonic Superchip. Discover how this revolutionary photonic interconnect technology is changing the game for Artificial Intelligence (AI) infrastructure by enabling massive scale-up bandwidth and radix,
Lightmatter’s 8X Leap: World-First 16-Wavelength Bidirectional Optical Link for AI Data Centers
World-first 16-wavelength bidirectional optical DWDM Link on a strand of standard single mode fiber. This Lightmatter breakthrough represents an 8X leap in bidirectional fiber bandwidth density and a doubling of radix, paving the way for the next generation of AI data centers.