End-to-End Quality and Reliability

This session introduces Lightmatter’s technology and product reliability qualification methodology, including the systematic integration of reliability activities across the entire product life cycle. Given the integration of EIC and PIC within a single package, rigorous and multi-level qualification is essential to overcome challenges like thermal management and limited field serviceability. It will provide an in-depth look at qualification tests to ensure the long-term reliability of CPO products, from fundamental device aging (PICs/EICs) and package-level thermal/mechanical endurance to overall system level reliability under operational and accelerated stress conditions.