vClick Optics

Industry-First Detachable DWDM Fiber Array Unit for 3D CPO

Advanced semiconductor packaging, including mold-and-grind flows used to build next-generation AI chips, destroys conventional fiber couplers on contact. vClick™ Optics is the first detachable Fiber Array Unit (FAU) with vertical coupling designed to survive it. The result is a low-loss, plug-and-play fiber attach interface that enables high-volume manufacturing (HVM) and deployment of  3D co-packaged optics (CPO).

Insertion Loss

< 1.5 dB

Insert / re-insert

Bandwidth Range

80+ nm

CWDM / DWDM

Durability

50+ cycles

Insertion cycles

Packaging

Mold & Grind

AP-compatible

Manufacturing

Shifting Left to Scale CPO Production

The Challenge

The rapid evolution of AI infrastructure drives unprecedented interconnect bandwidth needs that require DWDM optics, but integrating detachable wideband Fiber Array Units into advanced packaging environments of CPO solutions presents massive manufacturing challenges.

The vClick Implementation

By enabling known-good optical engine verification at the wafer level, vClick shifts verification earlier in the assembly cycle. This mold-and-grind compatible fiber array interface mitigates yield loss, ensuring 3D CPO platforms are ready for hyperscale deployment and field serviceability.

Key Features

HVM READY

Advanced Packaging Compatible

Integrates seamlessly with standard mold-and-grind semiconductor packaging flows used by major foundries and OSAT providers.

FIELD-SERVICEABLE

Detachable Connectivity

Developed alongside SENKO Advanced Components, vClick integrates SEAT™ and Metallic PIC Coupler (MPC) technologies to deliver low-loss, field-serviceable CPO connections.

RELIABLE RECONNECTION

Multi-Cycle Durability

Supports repeatable connect cycles while maintaining consistent optical performance.

ZERO ACTIVE ALIGNMENT

Automated Assembly

A vertically expanded-beam photonic interface eliminates the need for active fiber alignment during production or fiber attach, reducing assembly and test time.

Technical Specifications

Interface type

Detachable fiber array unit (dFAU)

Insertion loss

<1.5 dB (insertion and reinsertion)

Wavelength range

80+ nm broadband (CWDM / DWDM)

Coupling technology

Vertically expanded-beam photonics

Connector integration

SENKO SEAT™ / MPC connector

Packaging compatibility

Mold-and-grind (foundry/OSAT)

Coupling direction

Vertical (top-surface emission)

Assembly method

Passive alignment (wafer-level)

Connectivity Platforms

vClick™ Optics

The industry’s first advanced-packaging-compatible vertically detachable FAU, designed for high-density CPO solutions.

Explore Passage L200 →

eClick™ Optics

A high-performance edge-coupling solution optimizing die area for large-format hardware, providing massively scalable optical interconnects.

Explore Passage M1000 EVK →