PHOTONICS FOR AI
The Passage™ Silicon Photonics Engine supports single chip to multi-die complexes and all the way to wafer-scale. The world’s fastest interconnect.
Unrivaled Photonic Bandwidth
- Hundreds of Tbps bi-directional escape bandwidth with a single Passage PIC
- 56 Gbps/112 Gbps per lambda complete analog and optical datapath
Bandwidth From Anywhere
- Shatters shoreline limitations – electrical-to-optical conversion anywhere in chip area
- Massive expansion in escape bandwidth and radix
Flexible, Multi-Reticle Dicing Options
- Supports 1X to 8X reticle sizes, up to wafer scale with cross-reticle stitching
Reconfigurable Optical Circuit Switch (OCS) Network
- Flexible reconfiguration for redundancy, resiliency, and workload optimization
UNMATCHED RADIX
> 30x larger scale-up domain enabled by DWDM bidirectional links and ultra-dense fiber attach.
Highest radix per XPU
- Enables scale-up domain with thousands of XPUs
- Lowers latency, power and cost by reducing AI data center network tiers
16 lambda Bidirectional per Fiber
- Industry’s highest bandwidth per fiber
- Bi-directional links reduce fiber counts
Pluggable Fiber Connectors
- Low loss pluggable connector
- High density fiber attach
EXTREME INTEGRATION
Works with off-the-shelf chips thanks to integrated transistor and photonics control technology.
Integrated Photonics Control Circuitry
- Fully-integrated photonics and electronics
- Supports existing chips without re-design
Integrated Optical Circuit Switching
- Flexible topology, reconfiguration and infrastructure resiliency
Patented Cross-Reticle Waveguide Stitching
- Provides seamless cross-reticle chiplet interconnect
- Ultra low-loss reticle crossing
3D PHOTONICS PACKAGING
The largest photonics-enabled chip complexes with multi-reticle Passage in a 3D package.
3D Packaging
- Leverages mainstream chip-on-wafer capabilities for 3D photonic integration
- Single package integrates many chips on a multi-reticle Passage
Powered by Guide™ light engine
- DWDM laser array solution
- Highest laser density and optical power per package/module
Delivering power for high performance XPUs
- Deliver 1.5 kilowatt or more through Passage TSVs.
1 MILLION XPUS AND BEYOND
Largest AI data center scale-up and scale-out
- Passage enables 1M+ node clusters
- Powering the highest density AI clusters with hundreds of terabits per second per XPU
Leading OSAT and Fab Partnerships
- Providing a complete ecosystem for production