Form Factors
Complete Photonics Roadmap
Passage is available in both L- and M-series form factors, covering the entire spectrum from pluggable optics to 3D integration.
The Edgeless I/O Advantage
Traditional chip I/O—electrical and optical—is confined to die edges (shoreline). As die area scales (r²), perimeter only scales linearly (2πr), creating a bandwidth bottleneck.
Passage Solution: 3D vertical integration allows I/O placement across the entire die area. Bandwidth density scales with area (mm²), providing unlimited scaling headroom.
Available Form Factors
On Board
L-Series OBO
10x pluggable bandwidth in an ultra-high-density, serviceable module. Retimer required for extreme reach.
Near Package
L-Series NPO
10x pluggable bandwidth at a fraction of the energy. Minimized latency with linear-drive architecture.
Co-Packaged
L-Series CPO
High-efficiency, high-bandwidth chips co-packaged closely with XPU and switches.
Interposer Co-Packaged
M-Series
The ultimate in energy efficiency, bandwidth density, and speed. Edgeless I/O architecture.
Detachable Fiber
Field-serviceable fiber integration for mass deployment of Co-Packaged Optics. Wafer-level passive alignment sets the industry standard.
