
M1000
Photonic
Superchip
3D Photonic Interconnect for AI
The Passage™ M1000 3D Photonic Superchip reference platform demonstrates record-breaking 114 Tbps total bandwidth. A 4000 mm2 photonic interposer for massive die complexes. M1000 has 256 optical fibers and supports 1.5kW+ power delivery and the world’s first built-in solid state optical circuit switching.

No shoreline limits
Unleash I/O anywhere within your chip complex. Eliminate energy-draining, latency-heavy network-on-chip journeys. Outperform shoreline-limited technologies like conventional CPO, NPO, and pluggables.
High–Density Light Engine
The Guide™ Light Engine supports the M1000. 8 wavelength DWDM. Unprecedented optical power and reliability.

SPECIFICATIONS

M1000
Total I/O bandwidth
Power efficient SerDes
Wavelengths per fiber
Ultra-dense fiber attach
Massive amount of I/O
Power delivery
Biggest die complexes in a package
3D photonic chip-on-wafer package
Built-in optical circuit switching
Cross-reticle stitching
M1000 SUPERCHIP AND GUIDE LIGHT ENGINE
Applications Unlocked

Petabit Switch
>1,000 Tbps TOTAL BANDWIDTH
>50% AREA REDUCTION