Photonic Integrated Circuits and Photonic Interconnects
Explore the foundational principles of photonic integrated circuits (PICs) and photonic interconnects, such as co-packaged optics (CPO), in artificial intelligence (AI) data centers. This in-depth resource provides a technical overview of the underlying technologies, components, operation, commercial applications, challenges and solutions, illuminating the physics and engineering that define the cutting-edge of light-speed data center connectivity.
