IEEE Optical Interconnects and Packaging (OIP) Conference
Title: Edgeless I/O: 3D Photonics Tackles AI’s Communication
Speaker: Darius Bunandar, Chief Scientist
Description: The exponential growth of AI models is pushing conventional interconnects to their limits, creating critical bottlenecks in data center infrastructure. This presentation explores how 3D photonics, with its innovative “”edgeless I/O”” silicon design paradigm, is poised to overcome these reach and bandwidth constraints. We will delve into how this approach enables unprecedented scale-up bandwidth and performance for AI by facilitating direct, high-density connections between thousands of GPUs.
Realizing the immense benefits of 3D photonics, including co-packaged optics and active interposers, necessitates significant advancements in several key areas. This talk will highlight the critical communication and packaging challenges and innovations, including advanced silicon photonics integration, novel 3D packaging techniques, high-density laser arrays, and wavelength division multiplexing. We will discuss the path towards achieving sub-3 pJ/bit power efficiency and 100’s terabit-per-second connectivity, paving the way for the next generation of AI infrastructure.
When and Where:
Date: Monday June 16, 2025
Time: 2:30 – 5:45 PM
Location: The Elizabeth Hotel, Fort Collins, CO
About IEEE Optical Interconnects and Packaging (OIP) Conference:
The IEEE Optical Interconnects and Packaging (OIP) Conference—formerly known as Optical Interconnects (OI) Conference—is a single track, collaborative event dedicated to solving the future of high-density optical interconnects and packaging including evolving applications in
- High speed 200G/400G SerDes
- Energy efficient high density scale up/out interconnects
- Optical packaging and 3D-IC integration
- Next generation optical devices enabling high speed/low power
Learn more about our solutions:
Passage L200 3D CPO (co-packaged optics) Passage M1000 Superchip (active photonic interposer)