Reference Platform

Passage 100

Exascale Connectivity for AI.

Passage 100 represents a giant leap in photonic interconnect performance. Designed for the extreme demands of scale-up AI networks, it delivers massive bandwidth density and unprecedented energy efficiency.

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Aggregate I/O

3.4

Tbps Aggregate

Supporting 1.7 Tbps Unidirectional or 3.4 Tbps Bidirectional operation @ 112G PAM4.

Efficiency Target

3.4

pJ / bit

Target link efficiency for 112G PAM4 high-speed operation modes.

The Scale-Out Solution

Lightmatter’s second-generation link platform is engineered to meet the bandwidth explosion of exascale AI superpods. By integrating advanced Photonic Integrated Circuits (PIC) with high-performance optical DSPs in a 2D multi-chip package, Passage 100 de-risks the most aggressive roadmaps in the industry.

Throughput Architecture

3.4 Tbps Spectral Density

Utilizing a 16-wavelength 112G PAM4 architecture, Passage 100 operates in two modes: a 1.7 Tbps unidirectional link (one fiber Tx, one fiber Rx) or a 3.4 Tbps total aggregate bidirectional link on a single fiber using advanced circulators.

3.4 pJ/bit Target

Optimized for scale-up AI networks, Passage 100 leverages baud rate amortization to deliver elite efficiency. The platform assumes a 5% Wall-Plug Efficiency (WPE) for future Guide™ laser integration.

1.6 Laser
0.49 TIA
0.55 Control
0.76 PIC / OTHER
[ 0.0 ] SYSTEM TARGET: 3.4 pJ/bit
Hardware

Passage 100 Platform

The Passage 100 evaluation kit showcases Lightmatter’s advanced 2D multi-chip packaging technology with integrated photonic and electronic components.

16λ DWDM

Fiber Connectivity

16-wavelength bidirectional optical link with detachable fiber connectors

Horizon™ 2D

Multi-Chip Platform

Advanced packaging integrating photonic and electronic ICs

Passage 100 Technical Data

Ref: P100-EVK-DOC-002

Technical Specifications

Modulation Formats

53G NRZ, 106G PAM4 (112G Stretch)

Link Architecture

16λ Bidirectional DWDM (3.2 Tbps Aggregate)

Wavelength Grid

200 GHz Spacing centered at 1310 nm (O-band)

Packaging Technology

Horizon™ 2D Multi-chip Integration

Efficiency Target

3.4 pJ/bit (112G PAM4 Mode)

Throughput Modes

1.7 Tbps (UniDi) / 3.4 Tbps (BiDi Aggregate)

Fiber Count

2 Fibers (UniDi) / 1 Fiber (BiDi)

Pre-FEC BER Goal

< 1e-5

Chassis Form Factor

OCP Compliant Rack Integration

The Future of Exascale.

Passage 100 is the standard-bearer for AI infrastructure. Contact our engineering team for deep-dive technical reviews and integration roadmaps.

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